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| | | | | 参考UL478和IEC435(now retired), SPACING(mm)=0.6+Vpeak*0.005 |
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| | | | | | | 0.6+1000*0.005= 5.6mm,这个值太大有点不太实用哦
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| | | | | | | | | 手头没有这个完整的文档,资料是IBM的 AC/DC Power Supply Qualification Process 里面引用的“”The basis for the spacing design requirements is the following chart from UL 478 and IEC 435 (now retired).“
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| | | | | 从实际应用来看,使用FR4类材质,3.2mm间距可以满足实用.如是CM1类材质,需要开槽,否则容易后期失效. |
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| | | | | | | | | 资料是IBM的 AC/DC Power Supply Qualification Process 里面引用的“”The basis for the spacing design requirements is the following chart from UL 478 and IEC 435 (now retired).“
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| | | | | | | | | | | 我看有些资料上,板子电路如果单纯要求内部功能绝缘的情况,PCB耐压值可以放宽到1KV/MM,这说法不晓得怎么来的;
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| | | | | 1、海拔高度还得换算进去
2、PCB污染程度
我能想到的就这两个
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| | | | | | | | | | | 按IEC60950/EN60950/GB4943
840按功能绝缘是3.2;1400V对应4.2;则1000V的插值就是3.5mm,
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爬电距离
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